时间：2026年6月8-9日
Date: June 8-9, 2026
三星与英伟达深化AI半导体合作
Samsung and Nvidia Deepen AI Semiconductor Partnership Through HBM4 and Foundry Collaboration
摘要 :
三星电子副会长权五贤于6月8日在首尔与英伟达CEO黄仁勋会面。双方探讨了在HBM4内存和代工制造方面扩大合作。两家公司已在使用4nm和8nm制程技术的自动驾驶芯片和加速器产品上展开合作。三星已大力投资代工业务，包括在德克萨斯州泰勒工厂的量产准备。三星还推出了业界首款12层HBM4E样品，传输速度高达16Gbps。
Summary :
Samsung Electronics Vice Chairman Jun Young-hyun met with Nvidia CEO Jensen Huang on June 8 at the Nvidia Korea AI Ecosystem Reception in Seoul. The leaders discussed expanding cooperation on HBM4 memory and foundry manufacturing, with both companies already collaborating on autonomous driving chips and accelerator products using 4nm and 8nm process technologies. Samsung has invested heavily in its foundry business, including preparations for mass production at its Taylor, Texas facility. Samsung is also shipping the industry’s first 12-layer HBM4E samples, delivering up to 16Gbps transfer speeds.
入选理由 :
三星与英伟达CEO直接会面；730亿美元AI投资承诺；HBM4E样品提前交付。
Why Selected：
Direct meeting between Samsung and Nvidia CEOs; $73B AI investment commitment; HBM4E sample shipments ahead of schedule.
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