时间：2026年4月28日
Date: April 28, 2026
台积电3nm产能提升20% 2nm工艺年底冲刺
TSMC Increases 3nm Capacity by 20%, Accelerates 2nm Development for Year-End Launch
摘要 :
台积电宣布3nm芯片月产能提升至14万片（较原计划增长20%），同时2nm工艺进入风险量产阶段，预计2026年底正式交付客户。
产能提升主要受益于苹果A18芯片及英伟达H200 GPU订单增加，此次扩产将缓解全球AI芯片供应紧张局面。2nm工艺采用全环绕栅极（GAA）架构，晶体管密度较3nm提升70%，能效比提升25%，目前已收到谷歌TPU及亚马逊AWS的早期订单。受此消息推动，台积电股价当日上涨5.2%，市值突破7800亿美元。
Summary :
TSMC announced that monthly 3nm chip capacity will increase to 140,000 wafers (20% above original plan), while 2nm process enters risk production stage, with mass delivery to customers expected by the end of 2026.
Capacity expansion is primarily driven by increased orders for Apple’s A18 chip and NVIDIA’s H200 GPU, which will ease the global shortage of AI chips. The 2nm process adopts a Gate-All-Around (GAA) architecture, with transistor density 70% higher than 3nm and energy efficiency improved by 25%. Early orders have been received from Google TPU and Amazon AWS. Driven by this news, TSMC’s stock price rose 5.2% that day, with market value exceeding $780 billion.
入选理由 :
先进制程产能扩张与技术迭代同步推进，进一步拉大与三星、英特尔的工艺差距，巩固其在全球半导体产业链的核心地位，对AI算力、智能手机等关键领域的技术演进具有决定性影响。
Why Selected：
Simultaneous advancement of advanced process capacity expansion and technological iteration further widens the process gap with Samsung and Intel, consolidating TSMC’s core position in the global semiconductor industry chain and exerting a decisive impact on technological evolution in key fields such as AI computing power and smartphones.
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